Shenzhen AOCHUAN Technology CO., LTD.
Shenzhen AOCHUAN Technology CO., LTD.
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Types of Thermal Interface Materials
Thermal Pad
Thermal pads are ultra-soft and highly compressible and can be die-cut into specified shapes. AOK offers various models with thermal conductivity ranging from 1.0W/m.K to 12.0W/m·K to meet different application needs.
Liquid Gap Filler
AOK Liquid Gap Filler provides a highly adaptable, self-leveling thermal solution that seamlessly fills irregular gaps and complex geometries. Offering superior thermal conductivity and long-term reliability, it ensures effective heat dissipation in advanced electronic designs.
Thermal Grease
Thermal grease is used between heat sources such as CPUs and GPUs and heat sinks to reduce thermal resistance. AOK offers a variety of thermal grease models to meet different cooling needs and ensure stable operation of electronic devices.
Potting Compound
Thermally conductive potting compound is a two-component thermally conductive potting glue for encapsulation and heat dissipation of electronic components. AOK provides a variety of thermal conductivity options to protect electronic products and extend their service life.
Phase Change Thermal Interface Material
Phase change thermal interface materials undergo a phase change at a specific temperature, better filling contact surfaces and reducing thermal resistance. AOK offers products with various phase transition temperatures and thermal conductivity to improve heat dissipation efficiency.
Graphene Thermal Pad
AOK Graphene Thermal Pads deliver unprecedented cooling performance by integrating advanced graphene nanostructures. They offer superior thermal conductivity, exceptional stability, and reliable electrical insulation, ensuring optimal heat management for high-power electronic applications. Trust AOK for durable, high-performance thermal solutions.
Thermal Pad
Liquid Gap Filler
Thermal Grease
Potting Compound
Phase Change Thermal Interface Material
Liquid Metal Thermal Paste
Graphene Thermal Pad
AOK Thermal Interface Materials Solutions
Thermal Interface Materials in Electronic Vehicles Electronic Vehicles
Best-in-class thermal management material, adhesives, sealants, and coating technologies can support vehicle manufacturers and suppliers in addressing these challenges.
Thermal Interface Materials in Consumer Electronics Consumer Electronics
AOK thermal solutions enable slimmer, smarter consumer devices by effectively dissipating heat from compact processors, ensuring peak performance and extended product life.
Thermal Interface Materials in Security Security
Ensuring 24/7 reliability, AOK thermal materials protect critical surveillance and security hardware from overheating, supporting stable operation in demanding environments.
Thermal Interface Materials in Telecom Industry Telecom Industry
AOK provides high-performance thermal management for 5G infrastructure and networking equipment, maintaining signal stability and system durability under continuous heavy loads.
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AOK: Leading Thermal Interface Materials Manufacturer
AOK: Leading Thermal Interface Materials Manufacturer
Founded in 2004, AOK is a high-tech enterprise specializing in the development, production, and sales of thermal conductive and insulation materials. With ISO9001, ISO14001, and IATF16949 certifications, we are committed to providing reliable, high-performance solutions for the electronic vehicles, consumer electronics, and other demanding industries.
20 YEARS

Professional Experience


50 + KIND

Professional Experience

300 + PEOPLE

300+ employees, own R&D team, thermal management engineers

500 STRONG

Has a complete market and sales network at home and abroad

Quality and Reliability: Certified AOK Standards
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Ready to Optimize Your Thermal Management?
Ready to Optimize Your Thermal Management?
Contact us today for a customized thermal solution tailored to your specific needs. AOK is your trusted partner for high-performance thermal interface materials.
Latest News & Blogs about AOK
The Key Role and Applications of PI Film in Thermal Interface Materials | Electronics Thermal Management
The Key Role and Applications of PI Film in Thermal Interface Materials | Electronics Thermal Management
In an age where electronic devices are becoming increasingly precise and powerful, heat dissipation has emerged as a critical challenge for R&D engineers. Among the thermal interface materials we ...
The Key Role and Applications of PI Film in Thermal Interface Materials | Electronics Thermal Management
Sep 12, 2025
Graphene Thermal Pad vs Thermal Paste: Ultimate Heat Dissipation Guide 2025
Graphene Thermal Pad vs Thermal Paste: Ultimate Heat Dissipation Guide 2025
With the continuous improvement of electronic device performance, heat dissipation has become a critical challenge. Particularly for high-power, high-density chips that generate substantial heat durin...
Graphene Thermal Pad vs Thermal Paste: Ultimate Heat Dissipation Guide 2025
Aug 22, 2025
HGP Series Graphene Thermal Pad - Revolutionary Heat Dissipation Solution
HGP Series Graphene Thermal Pad - Revolutionary Heat Dissipation Solution
Electronic devices are getting smaller and more powerful, making heat dissipation a major challenge. Traditional thermal silicone pads are struggling to keep up with the pace - they have high thermal ...
HGP Series Graphene Thermal Pad - Revolutionary Heat Dissipation Solution
Jul 09, 2025
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